NP03SB3R3M [TAIYO YUDEN]
General Purpose Inductor, 3.3uH, 20%, 1 Element, Ferrite-Core, SMD, 1616, CHIP, ROHS COMPLIANT;
| 型号： | NP03SB3R3M |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | General Purpose Inductor, 3.3uH, 20%, 1 Element, Ferrite-Core, SMD, 1616, CHIP, ROHS COMPLIANT |
| 文件： | 总10页 (文件大小：1163K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMDインダクタ
SMD INDUCTORS
（製品
（Including self-generated heat）
自己発熱を含む）
OPERATING TEMP 03, 04タイプ
ー25～＋105℃
特長ꢀFEATURES
・省スペース及び低背
化
・Small surface area and low profile.
・大電流対応
・SMT対応
・Designed for high current applications where a surface mount compo-
nent is required.
・Available in embossed tape and reel.
用途ꢀAPPLICATIONS
・HDD、デジタルビデオカメラ、ノート型パソコンなど各種機器の
・Power supply circuits/DC-DC converters in a variety of applications where
電源
回路、DC / DCコンバータ等
compact size is vital, such as digital camcorders, HDD, notebook PCs, etc.
形名表記法ꢀORDERING CODE
1
3
5
7
形式
形状
公称インダクタンス〔μH〕
当社管理記号
△△
N P
チョークコイル（シールドタイプ）
例
標準品
△＝スペース
S△, SZ
ドラム応用形
1R0
1.0
△＝スペース
△＝スペース
100
10
※R=小数点
6
4
2
インダクタンス許容差
高さ寸法〔mm〕
コア寸法〔mm〕
03
04
M
N
±20％
±30％
03タイプ
04タイプ
2.0max.
3.8
4.7
B
1.8max.
○ ○
N P 0 4 S Z B 1 0 0 M
1
2
3
4
5
6
7
1
3
5
7
Type
N P
Shape
S△, SZ
Nominal inductance〔μH〕
example
Internal code
△△
Choke coil（shielded type）
Standard product
Applied drum type
1R0
100
1.0
10
△＝Blank space
△＝Blank space
△＝Blank space
※R=Decimal point
4
6
2
Heigh〔t mm〕
Inductance tolerance
Core dimension〔mm〕
03
04
03 type
1.8max.
04 type
2.0max.
M
N
±20％
±30％
3.8
4.7
B
350
外形寸法ꢀEXTERNAL DIMENSIONS
磁気シールド
Shielded type
Type
ꢀꢀꢀꢀꢀꢀ
NP03S
NP04S
Fig.
5
高さ記号
Height code
B
B, ZB
4.0±0.2
（0.157±0.008）
4.0±0.2
（0.157±0.008）
5.0±0.2
（0.197±0.008）
5.0±0.2
（0.197±0.008）
2.0
L
W
1.8
H（max.）
（0.071）
（0.079）
1.1±0.1
（0.043±0.004）
4.5±0.2
（0.177±0.008）
1.3±0.1
（0.051±0.004）
5.8±0.3
a
b
（0.228±0.012）
Unit：mm（inch）
推奨ランドパターンꢀRecommended Land Patterns
【NP03S type】
【NP04S type】
1.9
1.25
5.1
2.9
2.6
。
。
45
45
1.9
1.25
Unit：mm
概略バリエーション AVAILABLE INDUCTANCE RANGE
NP03S
（1.8max.）
（typ）
（typ）
（typ）
0.023
2.5
0.021
3.2
1μ
0.030
0.054
0.27
1.3
0.10
0.36
0.8
0.9
0.10
0.27
1.2
10μ
100μ
0.64
0.38
0.45
セレクションガイド
アイテム一覧
特性図
梱包
信頼性 使用上の注意
Selection Guide
Part Numbers
Electrical Characteristics
Packaging
Reliability Data
Precautions
P.12
P.352
P.353
P.354
P.366
P.374
etc
351
アイテム一覧ꢀPART NUMBERS
NP03SBシールドタイプꢀShielded type
定格電流 ※）
直流抵抗
自己共振
公ꢀꢀ称 インダクタンス
許容差
Inductance Inductance
EHS
測ꢀ定
Rated current
形ꢀꢀ名
周
波数
DC
（Environmental インダクタンス
〔A〕
Selfーresonant
周波数
Measuring
frequency
Resistance
〔mΩ〕
（typ.）
（max.）
frequency
Hazardous
直
流重 畳許容電流 温度上昇許容電流
〔MHz〕
（min.）
60
Saturation current Temperature rise current
Ordering code
Substances）
［μH］
Tolerance
Idc1
Idc2
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
NP03SB 1R0M
NP03SB 1R5M
NP03SB 2R0M
NP03SB 2R7M
NP03SB 3R3M
NP03SB 4R7M
NP03SB 6R8M
NP03SB 100M
NP03SB 150M
NP03SB 220M
NP03SB 330M
1.0
1.5
2.0
2.7
3.3
4.7
6.8
10
2
32
38
44
50
23
27
32
37
42
47
84
100
230
290
360
2.50
2.30
2.00
1.80
1.60
1.50
1.10
1.00
0.70
0.60
0.50
7
2.60
2.20
1.90
1.60
1.30
1.20
1.00
0.80
0.66
0.54
0.45
52
45
39
33
30
24
20
19
±20%
ー30%／＋10％
±20%
1kHz
56
100
120
270
340
430
15
22
33
14
10
NP04SBシールドタイプꢀShielded type
定格電流 ※）
直流抵抗
自己共振
公ꢀꢀ称 インダクタンス
許容差
Inductance Inductance
EHS
測ꢀ定
Rated current
周
波数
形ꢀꢀ名
DC
（Environmental インダクタンス
〔A〕
Selfーresonant
周波数
Measuring
frequency
Resistance
〔mΩ〕
frequency
Hazardous
直
流重 畳許容電流 温度上昇許容電流
〔MHz〕
（min.）
40
Saturation current Temperature rise current
Ordering code
Substances）
［μH］
3.3
Tolerance
（typ.）
30
Idc1
Idc2
（max.）
36
NP04SB 3R3N
1.30
1.20
1.05
0.90
0.62
0.51
0.42
0.38
2.60
2.30
2.00
1.90
1.40
1.20
1.10
0.80
RoHS
±30%
30
50
33
NP04SB 4R7N
RoHS
4.7
NP04SB 6R8N
27
19
15
12
10
53
66
120
150
260
43
54
100
120
210
RoHS
6.8
10
15
22
33
NP04SB 100M
RoHS
1kHz
NP04SB 150M
NP04SB 220M
NP04SB 330M
NP04SB 470M
RoHS
RoHS
RoHS
RoHS
±20%
47
8
320
270
NP04SZシールドタイプꢀShielded type
定格電流 ※）
直流抵抗
自己共振
公ꢀꢀ称 インダクタンス
許容差
Inductance Inductance
EHS
測ꢀ定
Rated current
形ꢀꢀ名
周
波数
DC
（Environmental インダクタンス
〔A〕
Selfーresonant
周波数
Measuring
frequency
Resistance
〔mΩ〕
（typ.）
（max.）
frequency
Hazardous
直
流重 畳許容電流 温度上昇許容電流
〔MHz〕
（min.）
96
Saturation current Temperature rise current
Ordering code
Substances）
［μH］
Tolerance
Idc1
4.00
3.30
2.70
2.50
2.20
1.80
1.50
1.30
0.95
0.77
0.64
Idc2
3.20
2.80
2.50
2.30
2.00
1.60
1.40
1.20
0.95
0.77
0.68
NP04SZB 1R0N
NP04SZB 1R5N
NP04SZB 2R2N
NP04SZB 2R7N
NP04SZB 3R3N
NP04SZB 4R7N
NP04SZB 6R8N
NP04SZB 100M
NP04SZB 150M
NP04SZB 220M
NP04SZB 300M
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
1.0
1.5
2.2
2.7
3.3
4.7
6.8
10
30
21
72
60
52
30
27
19
15
12
35
25
42
30
±30%
33
46
60
40
1kHz
100
120
130
250
300
370
75
90
100
180
210
270
15
22
±20%
10
8.5
30
※）直
流重 畳許容電流（Idc1）は、直流重 畳によるインダクタンス低下が30%以内となる直流電流値 （at 20℃）
The saturation current value（Idc1）is the DC current value having inductance decrease down to 30%.（at 20℃）
※）温度上昇許容電流（Idc2）は、温度上昇が40℃となる直
流電流値 （at 20℃）
The temperature rise current value（Idc2）is the DC current value having temperature increase up to 40℃.（at 20℃）
※）定格電流値 は直流重 畳許容電流、または温度上昇許容電流をいずれも満足する直流電流値
The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value.
352
特性図ꢀELECTRICAL CHARACTERISTICS
流重 畳特性例ꢀDC Bias characteristics（Measured by HP4262A）
NP03SB
330M
300M
220M
220M
150M
150M
4R7N
1R5N
100M
6R8N
3R3N
100M
6R8M
5
4R7M
3R3M
2R7M
2R7N
2R2N
2R0M
1R5M
1R0N
1R0M
温度特性例ꢀTemperature characteristics（Measured by HP4262A）
NP04SB, NP04SZB, NP03SB
353
梱包ꢀPACKAGING
①最小受注単位数 Minimum Quantity
④リーダー部・空部 Leader and Blank portion
標準数量 Standard quantity（pcs.）
テーピング Taped
3000
形ꢀꢀ式
Type
高さ記号
Height code
B
NP03S, NP04S, NP04SZ
②テーピング材質 Tape Material
⑤リール寸法 Reel size
リール寸法 Reel size〔mm〕
形ꢀ式
Type
（参考値
φD
330（12.99）
Reference values）
φd
t
NP03S, NP04S, NP04SZ
80（3.15）
17.5（0.689）
③テーピング寸法 Taping dimensions
エンボステープ（12mm幅）Embossed Tape（0.47 inches wide）
⑥トップテープ強度ꢀTop Tape Strength
トップテープのはがし力は、下図矢印方向にて0.1～0.7Nとなります。
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the
arrow as illutrated below.
挿入ピッチ
高さ記号
Height
チップ挿入部
Chip cavity
テープ厚
Tape thickness
み
形ꢀ式
Type
Insertion
pitch
code
B
A
B
F
K
T
NP03S
4.3
4.3
8.0
2.2
0.4
（0.169）（0.169）（0.315）（0.087）（0.016）
5.25 15.25 8.0 2.7 0.4
NP04S
B
NP04SZ
（0.207）（0.207）（0.315）（0.106）（0.016）
Unit：mm（inch）
354
RELIABILITY DATAꢀ
1/4
Specifled Value
Item
BRC1608 Type
BRL2012 Type
BRL2518 Type
Test Method and Remarks
NR30/40/60/80 Type
NR10050 Type
NP03/NP04 Type
－25～＋105℃
－25℃～＋105℃
－25℃～＋120℃
－25℃～＋105℃
Including self-generated heat
1.Operating Temperature
Range
－40℃～＋85℃
BRC1608, BRL2012, BRL2518 Type,
NR30/40/60/80 Type, NP03/NP04 Type
the product with taping.
2.Storage Temperature
Range
：
－5 to 40℃ for
NR10050 Type：0 ～40℃ for the product with taping.
5
Within the specified tolerance
3.Rated current
The maximum DC value having inductance decrease
within specified value and temperature increase within
40℃ by the application of DC bias.
Inductance decrease
BRC1608, BRL2012, BRL2518 Type, NR30/40/60/80type NP03, NP04, NR10050
30％
Within the specified tolerance
BRC1608, BRL2012, BRL2518 Type ： LCR Meter ： HP 4285A or
equivalent, Measuring frequency:Specified frequency
NR30/40/60/80 Type：LCR Meter：HP 4285A or equivalent, 100KHz, 1V
4.Inductance
NP03/NP04 Type：HP4284A or equivalent, 1KHz, 1V
NR10050Type：LCR Meter：HP 4263A or equivalent, 100KHz, 1V
DC ohmmeter：HIOKI 3227 or equivalent
Within the specified tolerance
Within the specification
5.DC Resistance
BRC1608, BRL2012, BRL2518 Type,NR30/40/60/80 Type,
NR10050Type ： Inpedance analyzer/material analyzer ：
HP4291A or equivalent
6.Self resonance frequency
NP03/NP04 Type ： Inpedance analyzer/material analyzer ：
HP4191A, 4192A or equivalent
Inductance change：
Within±10％
BRL2012
Inductance change：
Within±20％
7.Temperature characteristic
BRC1608, BRL2012, BRL2518 Type, NR30/40/60/80 Type,
NR10050Type：Measurement of inductance shall be taken at
temperature range within －25℃～＋85℃.
BRL2518
Inductance change：
Within±15％
With reference to inductance value at ＋20℃., change rate shall
be calculated.
BRC1608
NP03/NP04 Type：Measurement of inductance shall be taken
at temperature range within －25℃～＋105℃.
Inductance change：
Within±20％
Withreferencetoinductancevalueat＋20℃.,changerateshallbecalculated.
Change of maximum inductance deviation in step 1 to 5
Temperature at step 1
Temperature at step 2
Temperature at step 3
Temperature at step 4
Temperature st step 5
20℃
Minimum operating
temperature
20℃（Standard temperature）
Maximum oparating
temperature
20℃
8.Resistance to flexure of
No damage.
BRC1608, BRL2012, BRL2518 Type
substrate
NR30/40/60/80 Type：The test samples shall be soldered to
the test board by the reflow .
As illustrated below, apply force in the direction of the arrow
indicating until deflection of the test board reaches to 2 mm.
Test board size：100×40×1.0
Test board material：glass epoxy-resin
Solder cream thickness：0.15
Land dimension（BRC1608）
Land dimension（BRL2012）
1.0
1.4
0.8
0.55
0.55
0.9
0.65
0.65
Land dimension（BRL2518）
Land dimension（NR30）
1.95
2.7
0.65 1.5 0.65
0.8 1.4 0.8
Land dimension（NR40）
Land dimension（NR60）
3.7
5.7
1.15 3.7 1.15
Force Rod
1.2 1.6 1.2
Land dimension（NR80）
20
10
R230
7.5
1.8 3.8 1.8
Board
Printed board thickness: 1.0mm
Test Sample
R5
45±2mm
45±2mm
Uni：t mm
9.Insulation resistance：
between wires
NP03/NP04 Type：
100MΩ min
100MΩ min
No abnormality
Applied voltage：100VDC Duration：60 sec
NP03/NP04 Type：
10.Insulation resistance：
ꢀ
between wire and core
Applied voltage：100VDC Duration：60 sec
NP03/NP04 Type：
11.Withstanding voltage：
between wires and core
Applied voltage：500VAC Duration：60 sec
367
RELIABILITY DATAꢀ
2/4
Specifled Value
Item
BRC1608 Type
BRL2012 Type
BRL2518 Type
Test Method and Remarks
NR30/40/60/80 Type
NR10050 Type
NP03/NP04 Type
No abnormality
BRC1608, BRL2012, BRL2518 Type：
Applied force：10N to X direction
Duration：5 sec.
12.Adhesion of terminal
electrode
Test substrate：ꢀPrinted board
NR30/40/60/80Type：
The test samples shall be soldered to the test board by
the reflow.
5
pplied force：10N to X and Y directions. Duration：5s.
Solder cream thickness：0.15mm.
10N, 5s
NR10050Type：
Applied force：5N to X and Y directions. Duration：5s.
NP03/NP04 Type：
Self testing jigs perpendicularly to top sureface of speci-
men mounted
on printed board, andapply specified static load for 5 sec
Specified static load
Type
static load
NP03S
NP04S
5N
Inductance change：Within±10％
Inductance change：
Within±5％
NR30/40/60/80 Type, NR10050Type ： The test samples
shall be soldered to the test board by the reflow.
Then it shall be submitted to below test conditions.
13.Resistance to vibration
No significant abnormality in appearance.
Frequency Range 10～55Hz
1.5mm（May not exceed
Total Amplitude
acceleration 196 m/S2）
Sweeping Method 10Hz to 55Hz to 10 Hz for 1 min.
X
For 2 hours on each X,
Time
Y
Z
Y, and Z axis.
NP03/NP04 Type：According to JIS 0040,
BRC1608, BRL2012, BRL2518 Type ： According to JIS
C5102 clause 8.2, The test samples shall be soldered to the
test board by the reflow. Then it shall be submitted to below
test conditions.
Frequency Range 10～55Hz
1.5mm（May not exceed
Total Amplitude
acceleration 196 m/S2）
Sweeping Method 10Hz to 55Hz to 10 Hz for 1 min.
X
For 2 hours on each X,
Time
Y
Z
Y, and Z axis.
A kind of vibration
A
Recovery：At least 2hrs of recovery under the standard con-
dition sfter the test, followed by the measurement within 48 hrs.
BRC1608, BRL2012, BRL2518 Type, NR30/40/60/80 Type,ꢀ
NR10050 Type：The test samples shall be dipped in flux, and
then immersed in molten solder as shown in below tableꢀ
Flux：Methanol solution containing rosin 25％.
95％ or more of mount-
ing terminal side shall
be covered with fresh
solder
At least 90％of surface of terminal electrode is
14.Solderability
covered by new solder.
NR30/40/60/80 Type,NR10050 Type :
Solder Temperature
Time
245±5℃
5±1.0sec
BRC1608, BRL2012, BRL2518 Type：
Solder Temperature
Time
245±5℃
5±0.5sec
NP03/NP04 Type：
Solder Temperature
Time
235±5℃
2±0.5sec
※Immersion depth：All sides of mounting terminal shall
be immersed.
369
RELIABILITY DATAꢀ
3/4
Specifled Value
Item
BRC1608 Type
BRL2012 Type
BRL2518 Type
Test Method and Remarks
NR10050 Type
03/04 Type
NR30/40/60/80 Type
Inductance change：Within±10％
BRC1608, BRL2012, BRL2518 Type ： 3 times of reflow
15.Resistance to soldering
No abnormality.
No significant abnormality in appearance.
oven at 230℃MIN for 40 sec. with peak temperature
＋0
heat
at 260
℃ for 5 sec.
－5
NR30/40/60/80 Type, NR10050 Type：The test sample shall
be exposed to reflow oven at 230±5℃ for 40 seconds,
with peak temperature at 260±5℃ for 5 seconds, 2 times.
Test board thickness：1.0 mm
5
Test board material : glass epoxy-resin
NP03/NP04Type（Reflow Condition）
Peak temperature
Temp.rag 150～180℃ 180℃ min
240～250℃
Duration 120～150sec 40～60sec
Within 5sec
Recovery ： At least 2hrs of recovery under the standard
condition after the test , followed by the measurement
within 48 hrs.
Inductance change：Within±10％
16.Thermal shock
BRC1608, BRL2012, BRL2518 Type：The test samples
shall be soldered to the test board by the reflow. The
test samples shall be placed at specified temperature
for specified time by step 1 to step 4 as shown in below
table in sequence. The temperature cycle shall be
repeated 100 cycles.
No significant abnormality in appearance.
Conditions of 1 cycle
Step
Temperature（℃） Duration（min）
1
2
3
4
－40±3
Room temperature
＋85±2
30±3
Within 3
30±3
Room temperature
Within 3
NR30/40/60/80 Type, NR10050 Type：The test samples
shall be soldered to the test board by the reflow. The
test samples shall be placed at specified temperature
for specified time by step 1 to step 4 as shown in below
table in sequence. The temperature cycle shall be
repeated 10 cycles.
Conditions of 1 cycle
Step
Temperature（℃） Duration（min）
1
2
3
4
－40±3
Room temperature
＋85±2
30±3
Within 3
30±3
Room temperature
Within 3
According to JIS 0025
NP03/NP04 Type：
Conditions of 1 cycle
Step
Temperature（℃） Duration（min）
＋0
1
2
3
4
－25
30±3
Within 3
30±3
－3
Room temperature
＋2
－0
＋105
Room temperature
Within 3
Number of cycle：10 cycles
Recovery：At least 2 hrs of recovery under the standard
condition after the test ,followed by the measurement
within 48 hrs.
Inductance change：Within±10％
BRC1608, BRL2012, BRL2518 Type：
17.Damp heat
Temperature
Humidity
Time
60±2℃
90～95％RH
1000 hours.
No significant abnormality in appearance.
Recovery： At least 2hrs of recovery under the standard
condition after the test, followed by the measurement
within 48 hrs.
NR30/40/60/80 Type ： The test samples shall be soldered
to the test board by the reflow.
The test samples shall be placed in thermostatic oven set
at specified temperature and humidity as shown in below
table.
Temperature
Humidity
Time
60±2℃
90～95％RH
500±24hour
371
RELIABILITY DATAꢀ
4/4
Specifled Value
Item
BRC1608 Type
BRL2012 Type
BRL2518 Type
Test Method and Remarks
NP03/NP04 Type
NR30/40/60/80 Type
NR10050 Type
Inductance change：Within±10％
18.Loading under damp
BRC1608, BRL2012, BRL2518 Type：
Temperature
60±2℃
No significant abnormality in appearance.
heat
Humidity
90～95％RH
Rated current
1000hours.
Applied current
Time
Recovery： At least 2hrs of recovery under the standard
condition after the test, followed by the measurement
within 48 hrs.
5
NR30/40/60/80 Type, NR10050 Type ： The test samples
shall be soldered to the test board by the reflow.
The test samples shall be placed in thermostatic oven
set at specified temperature and humidity and applied
the rated current continuously as shown in below table.
Temperature
Humidity
60±2℃
90～95％RH
Rated current
500±2hour
Applied current
Time
NP03/NP04 Type：
Temperature
Humidity
40±2℃
90～95％RH
Rated current
240±2hour
ꢀꢀꢀ
Applied current
Time
Recovery：At least 2hrs of recovery under the standard condi-
tion after the test ,followed by the measurement within 48 hrs.
BRC1608, BRL2012, BRL2518 Type：
19.Low temperature life test
Inductance change：Within±10％
Temperature
ー40±2℃
1000hours
No significant abnormality in appearance.
Duration
Recovery： At least 2hrs of recovery under the standard
condition after the test, followed by the measurement
within 48 hrs.
NR30/40/60/80, NR10050 Type ： The test samples shall
be soldered to the test board by the reflow.
After that, the test samples shall be placed at test condi-
tions as shown in below table.
Temperature
Time
－40±3℃
500±24hour
NP03/NP04 Type：
Temperature
Time
－40±3℃
240±2hour
Recovery：At least 2 hrs of recovery under the standard
condition after the test, followed by the measurement
within 48 hrs.
BRC1608, BRL2012, BRL2518 Type：
Inductance change ：
Within±10％
Inductance change：Within±10％
20.High temperature life
Temperature
85±2℃
No significant abnormality in appearance.
test
Duration
1000hours
No significant abnor-
Recovery： At least 2hrs of recovery under the standard
condition after the test, followed by the measurement
within 48 hrs.
mality in appearance.
NP03/NP04 Type：
Temperature
105±3℃
Time
240±2hour
NR10050 Type：
Temperature
Time
105±3℃
500±24hour
Recovery： At least 2hrs of recovery under the standard
condition after the test, followed by the measurement
within 48 hrs.
21.Loading at high
NR30/40/60/80 Type ： The test samples shall be sol-
dered to the test board by the reflow soldering
Inductance change ：
temperature life test
Within±10％
Temperature
Applied current
Time
85±2℃
Rated current
No significant abnor-
mality in appearance.
500±24hour
Standard test condition ： Unless otherwise specified, temperature is 20±15％ and 65±20％of
relative humidity.
22.Standard condition
When there are question concerning measurement result : In order to provide correlation date, the
test shall be condition of 20±2℃ of temperature, 65±5% relative humidity.
Inductance is in accordance with our measured value.
373
PRECAUTIONS
SMD Inductors
Stages
Precautions
Technical considerations
1.Circuit Design
Operating environment,
1.The products described in this specification are intended for
use in general electronic equipment,(office supply
equipment, telecommunications systems, measuring
equipment, and household equipment). They are not
intended for use in mission-critical equipment or systems
requiring special quality and high reliability (traffic systems,
safety equipment, aerospace systems, nuclear control
systems and medical equipment including life-support
systems,) where product failure might result in loss of life,
injury or damage. For such uses, contact TAIYO YUDEN
Sales Department in advance.
2.PCB Design
Land pattern design
1.Please refer to a recommended land pattern.
Surface Mounting
・Mounting and soldering conditions should be checked beforehand.
・Applicable soldering process to this products is reflow soldering only.
5
3.Considerations for
automatic placement
Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it
may deform the products.
1.Excessive impact load should not be imposed on the
products when mounting onto the PC boards.
2.Mounting and soldering conditions should be checked
beforehand.
4.Soldering
Reflow soldering
1.If products are used beyond the range of the recommended conditions, heat stresses
may deform the products, and consequently degrade the reliability of the products.
1.Please contact any of our offices for a reflow soldering, and
refer to the recommended condition specified.
2.This products is reflow soldering only.
【BRC1608, BRL2012, BRL2518 Type, NR30/40/60/80 Type】
Recommended reflow condition（Pb free solder）
【NP03/NP04 Type】
Recommended reflow condition（Pb free solder）
240～250℃ Within 5sec
3.Please do not add any stress to a product until it returns in
normal temperature after reflow soldering.
Lead free soldering
250
300
Peak：250＋5/ー0℃
5sec max
200
180
150
150～180℃
200
1.When using products with lead free soldering, we request to
use them after confirming of adhesion, temperature of
resistance to soldering heat, soldering etc sufficiently.
Recommended conditions for using a soldering iron:
(NP03/NP04, NR10050 type)
30±10sec
100
50
0
100
230℃ min
90±30sec
100～120sec
40～60sec
0
Heating Time［sec］
Duration［sec］
Recommended reflow condition（Pb solder）
10sec max
Recommended reflow condition（Pb solder）
230～240℃ Within 5sec
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350 ℃
Duration - 3 seconds or less
300
200
100
250
Peak：
200
180
150
150±10℃
240±5℃
60～70
sec
30sec
max
The soldering iron should not directly touch the inductor.
100
50
0
80～100sec
200±5℃
Heating Time［sec］
110sec max
Duration[sec]
40sec max
0
【NR10050 Type】
Recommended reflow condition（Pb free solder）
300
200
100
250＋5/ー0℃
230℃ or more
30±10sec
180℃
150℃
90±30sec
0
Heating Time[sec]
5.Cleaning
6.Handling
Cleaning conditions
1.SMD Inductors
Please contact any of our offices for a cleaning,
Handling
ꢀ1.There is a case that a characteristic varies with magnetic influence.
1.Keep the product away from all magnets and magnetic
objects.
Breakaway PC boards (splitting along perforations)
1.When splitting the PC board after mounting product, care
should be taken not to give any stresses of deflection or
twisting to the board.
1.Planning pattern configurations and the position of products should be carefully
performed to minimize stress.
2.Board separation should not be done manually, but by using
the appropriate devices.
Mechanical considerations
1.There is a case to be damaged by a mechanical shock.
1.Please do not give the product any excessive mechanical
shocks.
2.There is a case to be broken by the handling in transportation.
2.Please do not add any shock and power to a product in
transportation.
Pick-up pressure
1.Damage and a characteristic can vary with an excessive shock or stress.
1.Please do not push to add any pressure to a winding part.
Please do not give any shock and push into a ferrite core
exposure part.
Packing
1.There is a case that transformation and a product of tape are damaged by
accumulation of a packing box.
1.Please avoid accumulation of a packing box as much as
possible.
Storage
7.Storage conditions
1.Under a high temperature and humidity environment, problems such as reduced
solderability caused by oxidation of terminal electrodes and deterioration of
taping/packaging materials may take place.
1.To maintain the solderability of terminal electrodes and to
keep the packing material in good condition, temperature
and humidity in the storage area should be controlled.
・Recommended conditions
ꢀAmbient temperatureꢀꢀꢀꢀꢀ 0～40℃
ꢀHumidity
ꢀBelow 70% RH
The ambient temperature must be kept below 30℃. Even
under ideal storage conditions, solderability of products
electrodes may decrease as time passes. For this reason,
product should be used within one year from the time of
delivery.
In case of storage over 6 months, solderability shall be
checked before actual usage.
375
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